Fluxul procesului de substrat de aluminiu

1. Deschidere

Proces de producere a substratului de aluminiu

1. Procesul de tăiere a materialului - tăiere

2. Scopul deschiderii

Tăiați-materialele primite la dimensiunea necesară pentru producție

3. Precauții pentru deschiderea materialelor

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Foraj

1. Proces de forare

Dibluri - Foraj - Placă de inspecție

2. Scopul forajului

Poziționarea și găurirea plăcii pentru a ajuta procesul de producție ulterior și asamblarea clientului

3. Precauții pentru foraj

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

Al doilea burghiu: gaura pentru scule în unitate după masca de lipit

3. Imagini cu film uscat/umed

1. Proces de filmare uscată/umedă

Placă de șlefuit - film - expunere - dezvoltare

2. Scopul imaginii filmului uscat/umed

Piesele necesare realizării circuitului sunt redate pe foaie

3. Măsuri de precauție pentru filmul uscat/umed

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Gravare acidă/alcalină

1. Proces de gravare acid/alcalină

Gravare - decapare - uscare - placă de inspecție

2. Scopul gravării acidului/alcalin

După imaginea filmului uscat/umed, păstrați partea necesară a circuitului, îndepărtați partea în exces în afara circuitului și acordați atenție coroziunii substratului de aluminiu de către soluția de gravare în timpul gravării cu acid;

3. Precauții pentru gravarea acidă/alcalină

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Cinci, masca de lipit ecran de mătase, personaje

1. Mască de lipit ecran de mătase, proces de caractere

Serigrafie - Pre-coacere - Expunere - Dezvoltare - Caractere

2. Scopul masca de lipit ecran de mătase și personaje

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Chestiuni care necesită atenție pentru masca de lipit și personaje

① To check whether there is garbage or foreign matter on the board

Substrat din aluminiu COB

Substrat din aluminiu COB

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, scândură de gong

1. V-CUT, proces de bord de gong

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-CUT, scopul plăcii de gong

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Precauții pentru V-CUT și placa de gong

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Șapte, test, OSP

1. Test, proces OSP

Test de linie - Test de tensiune de rezistență - OSP

2. Testarea, scopul OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, testare, precauții OSP

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Opt, FQC, FQA, ambalare, transport

1. Proces

FQC - FQA - Ambalare - Expediere

2. Scop

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Fii atent

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3